#22Raised Floor Signal Reference Grid (SRG) & ESD Grounding Test
Multi-Asset / Multi-Point Equipment Schedule
Inspect multiple transformers, panels, rooms, motors, or RCDs in this module without overwriting previous assets. Each item receives a permanent QR Sticker UID preserved across annual audits.
Sticker UID: OC-SRG0-86E5Standard Limits, Equations & Space Presets
IEEE Std 1100 Signal Reference Grid (SRG) high-frequency equipotentiality, ANSI/TIA-607-D rack bonding resistance, and ANSI/ESD S20.20 (STM7.1 / STM97.2) static dissipative flooring verification.
Measured Inputs
Calculated / Evaluated Results
ANSI/TIA-607-D requires <= 1 Ohm between bonded points; the point-to-point grid target below 0.1 Ohm is a commissioning convention. ESD floor bands come from ANSI/ESD S20.20 measured to STM7.1.
Pending / Not tested — results stay neutral until valid measured values are entered.
- Pending
Bonding Continuity to Busbar
- mOhm
Not tested - enter the measured value. Acceptance: <= 1 Ohm (1000 mOhm) between any two bonded points [ANSI/TIA-607-D]
- Pending
Point-to-Point Grid Resistance
- mOhm
Not tested - enter the measured value. Acceptance: <= 0.1 Ohm (100 mOhm) across grid nodes [IEEE 1100 commissioning convention]
- Pending
High Frequency Impedance at 1 MHz
- Ohm
Not tested - enter the measured value. Acceptance: <= 1 Ohm - low HF impedance is what makes the grid a signal reference [IEEE 1100 field convention]
- Pending
ESD Floor Resistance to Ground
- Ohm
Not tested - < 1E6 Ohm: conductive flooring - acceptable in an ESD protected area when personnel grounding is controlled. [ANSI/ESD S20.20 via STM7.1]
- Pending
Walking Body Voltage
- V
Not tested - enter the measured value. Acceptance: The flooring and footwear system must keep body voltage below 100 V [ANSI/ESD S20.20 Table 1 (STM97.2)]
- Pending
SRG Grid Mesh Spacing
- m
Not tested - enter the measured value. Acceptance: Mesh spacing <= 0.60 m (600 x 600 mm raised floor pedestal grid for HF equipotentiality) [IEEE 1100 §8.5 / ANSI-TIA-607-D]
Verification Checklist (0 / 13)
1Signal Reference Grid (SRG) copper strap or round-wire mesh spacing verified <= 0.60 m x 0.60 m (2 ft x 2 ft) across raised floor [IEEE 1100 §8.5]
2Grid intersections exothermically welded, brazed, or clamped with listed low-impedance connectors
3Every 6th raised-floor pedestal (or max 1.8-2.4 m spacing) bonded to the SRG with >= 6 mm2 (#10 AWG) braided/stranded copper jumper
4Every IT server rack, network cabinet, PDU, and CRAH frame bonded to SRG with short, flat braided copper strap (L:W ratio <= 5:1)
5Two-point Ductor / 4-wire Kelvin micro-ohm resistance from rack frame to Telecommunication Grounding Busbar (TGB) verified <= 1000 mOhm (1.0 Ohm) [ANSI/TIA-607-D]
6Point-to-point DC resistance across adjacent SRG grid nodes verified <= 100 mOhm (0.1 Ohm) [IEEE 1100 commissioning target]
7High-frequency impedance across SRG verified <= 1.0 Ohm at 1 MHz to guarantee equipotential plane against fast transients
8Metallic cable trays, basket containment, chilled-water pipes, and fire suppression piping bonded to SRG at regular intervals
9Raised floor tile point-to-ground resistance R_esd measured at 100 V DC (5 lb / 2.27 kg electrode per ANSI/ESD STM7.1) within 1.0E6 to 1.0E9 Ohm dissipative band [ANSI/ESD S20.20]
10Human body voltage generation during walking test (ANSI/ESD STM97.2) verified < 100 V peak across data hall floor
11Technician wrist-strap bonding jacks at server racks verified with 1 MOhm current-limiting series resistor
12Zero isolated ('floating') metallic floor stringers or containment sections found during continuity sweep
13As-built SRG bonding map and ESD tile resistance zone grid archived in facility commissioning register
General Notes
Free plan: 5 of 5 inspections / calculations left this month.